Flexible LEDs strips with staggered interconnects

ABSTRACT

A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

PRIORITY CLAIM

This application is a continuation of U.S. patent application Ser. No.17/125,878, filed Dec. 17, 2020, which claims the benefit of priorityunder 35 U.S.C. § 119(e) of U.S. Provisional Patent Application Ser. No.62/951,904, filed on Dec. 20, 2019, both of which are hereinincorporated by reference in their entirety.

TECHNICAL FIELD

The present disclosure relates generally to a ceiling or generalillumination flexible strip LED light assemblies with improvedmechanical and electrical attachment.

BACKGROUND

Flexible circuit boards or tape systems are widely used to provide powerand control to LED lighting systems. Such flexible circuit boards, oftenknown as a LED light strips, can include multiple LEDs of the same ordifferent color that can be mounted within light fixtures or on ceilingsor walls of buildings. Some types of light strips can use permanent ordetachable electrical connectors to connect additional light stripsegments together.

One common method of connecting LED light strip segments together relieson overlapping edge positioned solder pads from two separate LED lightstrips and providing a solder joint that mechanically and electricallyconnects together the LED light strips. Unfortunately, such connectedLED light strip segments can be fragile, with overlapping solder joinsbeing susceptible to mechanical breakage when the LED light strips aresubjected to twist or pull apart force.

SUMMARY

In one embodiment, a flexible light emitting diode (LED) supportassembly includes a flexible circuit having a first layer, the firstlayer including a conductive material configured to connect to an LEDdie; a second layer, the second layer including an electricallyinsulating material; and a third layer positioned between the first andsecond layer, the third layer having a first terminal extendedelectrically connecting tab that extends outward beyond the first layerand the second layer. The LED assembly can further include the LED dieelectrically connected to the first layer. The second layer can includean adhesive material. The first terminal extended connecting tab caninclude exposed solder pads. The number of the exposed solder pads canbe equal to a number of colors of LEDs in the LED die.

The LED assembly can further include a fourth layer including a secondterminal extended connecting tab. The LED assembly can further include afifth layer positioned between the first and second terminal extendedconnecting tabs, the fifth layer including electrically insulatingmaterial, and the second terminal extended connecting tab extendingoutward beyond the first, second, and fourth layers. The second terminalextended connecting tab can extend outward beyond the first layer, thesecond layer, and fourth layer in a direction opposite the firstterminal extended connecting tab. The pads on the first terminalextended connecting tab can face a first direction and the pads on thesecond terminal extended connecting tab can face a second directionopposite the first direction.

The pads on the first terminal extended connecting tab are offset fromthe pads on the second terminal extended connecting tab (such that thepads on the different extended terminal connecting tabs are notsuperposed or so that the footprints of the pads only partiallyoverlap). The LED assembly can include a second flexible circuitelectrically and mechanically coupled to the first terminal extendedelectrically connecting tab using a conductive adhesive.

Pads on an end of the flexible circuit opposite the first terminalextended electrically connecting tab can be electrically connected tothe first terminal extended electrically connecting tab. The LEDassembly can further include power and control circuitry coupled to theflexible circuit, the power and control circuitry configured to providepower to the LED assembly and control color and brightness of lightemitted by the LED die.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates is a top “X-ray” view of a portion of a lightemitting diode (LED) light strip system.

FIG. 2A illustrates a top view of a four color (e.g., red (R), green(G), blue (B), and white (W) (RGBW), or other color) LED light strip.

FIG. 2B illustrates the LED light strip of FIG. 2A after the connectingtabs are situated proximate each other, such as for soldering the pads.

FIG. 3A illustrates a bottom view of the LED light strip.

FIG. 3B illustrates the LED light strip of FIG. 3A after the connectingtabs are situated proximate each other, such as for soldering the padstogether.

FIGS. 4 and 5 illustrate alternative cross sections of LED light strips.

FIG. 6 illustrates in cross section an alternative of an LED lightstrip.

FIG. 7 illustrates in cross-section an alternative of an LED lightstrip.

FIG. 8 illustrates a cross-section view of two ends of one or more LEDlight strips being electrically connected at connecting tabs thereof.

FIG. 9 illustrates a cross-section view of two ends of one or more LEDlight strips being electrically connected at connecting tabs (the innerconnecting tabs are not labeled so as to not obscure the view) thereof.

FIG. 10 illustrates a cross-section view of two ends of one or more LEDlight strips being electrically connected.

FIG. 11 illustrates a cross-section view of two ends of one or more LEDlight strips in close proximity, before electrical connection.

FIG. 12 illustrates a cross-section view of the two ends of the one ormore LED light strips of FIG. 11 after electrical connection.

FIG. 13 illustrates a cross-section view of two ends of one or more LEDlight strips that, after electrical connection, include offsetconductive joints.

FIG. 14 illustrates an example of a cross-section view of the two endsof the one or more LED light strips of FIG. 13 after electricalconnection.

FIG. 15 illustrates another example of a cross-section view of the twoends of the one or more LED light strips of FIG. 13 after electricalconnection.

FIG. 16 illustrates a power and control circuitry system for controllingan LED light strip.

DETAILED DESCRIPTION

FIG. 1 illustrates is a top “X-ray” view of a portion of a lightemitting diode (LED) light strip system 100. The system 100 includes aconnecting tab 130 with solder pads 132. The solder pads 132 can beelectrically connected to solder pads 132 of another flexible printedcircuit board (PCB).

A flexible printed circuit board (PCB) 110 can have multiple layers. Oneor more of the layers of the flexible PCB 110 can include mechanicalsupport or electrical insulation for electrical elements. In someembodiments a layer of the PCB 110 can include an adhesive tomechanically couple layers to each other. The electrical elements caninclude an etched circuit trace 120, a ground plane, pads 122, or thelike.

Circuit traces 120 can provide electrical connection to LED die pads 122for power and control. In the illustrated embodiment, the terminalconnecting tab 130 is not formed from a top or bottom layer of theflexible printed circuit board 110 but is instead formed from anintermediate layer (a layer between a top layer and a bottom layer). Theextending intermediate layer extends outside a footprint defining aperimeter of the top and bottom layers. The extending intermediate layerforming the terminal connecting tab 130 can be used to provide anelectrical connection to another flexible PCB or other electricalcircuit element. In some embodiments, the flexible PCB 110 can beconnected to itself to form a circular or other shaped light strip. Theextending connecting tab 130 can be electrically connected to a matingset of solder pads that are recessed in an opposite end of the flexiblePCB 110.

In addition to LEDs, the flexible printed circuit board 110 can supportpassive electronic components such as resistors or capacitors, andactive electronic components such as LED driver components (e.g.,amplifiers, transistors, or the like). The LEDs can be individually set,grouped, or set into an array. The LEDs can emit light of a single coloror can emit multiple colors. The flexible PCB 110 can be serially, inparallel, or separately connected to a power and LED control unit (seeFIG. 9 ).

The flexible PCB 110 can be laminated onto frames for mechanical supportand cooling. In one embodiment, the frame can be a circular metal framecut from a stainless steel or aluminum cylinder. Other shapes are alsopossible, including rectangular, ovoid, or irregular. In someembodiments a solid frame is not required, with separated studs orattachment points being used to hold the flexible PCB 110. Typically, aheight of the frame should be at least as wide as the flexible PCB 110.The frame can also be used to elevate the flexible PCB 110 to a suitableheight that is determined by the optical design. The frame can havemechanical features that allow quick and easy rigid attachment to abaseplate, including but not limited to spring latches, clips, or screwthreaded attachment points.

FIG. 2A illustrates a top view of a four color (e.g., red (R), green(G), blue (B), and white (W) (RGBW), or other color) LED light strip200. The LED light strip 200 includes a flexible PCB 210 with connectingtabs 230, 231 positioned at opposing ends 232, 233, respectively. Thetop side includes attached LEDs 236. LEDs of a first color can beelectrically coupled to a first pad 234A of the connecting tab 230 and afirst pad 235A of the connecting tab 231, LEDs of a second color can beelectrically coupled to a second pad 234B of the connecting tab 231 anda second pad 235B of the connecting tab 231, and so on. Such aconfiguration allows for power to be provided to all LEDs of a specificcolor simultaneously. In some embodiments, the connecting tabs 230, 231are formed under a topmost layer of the flexible PCB 210. In someembodiments, the connecting tabs 230, 231 include a proper subset of thelayers of the remainder of the flexible PCB 200. In some embodiments,the pads 234A, 235A are electrically coupled to LEDs of a first color,the pads 234B, 235B are electrically coupled to LEDs of a second color,the pads 234C, 235C are electrically coupled to LEDs of a third color,and the pads 234D, 235D are electrically coupled to LEDs of a fourthcolor. This is sometimes called a “symmetric” configuration. In thesymmetric configuration, the pads most proximate to the side 240 (thepads 234A, 235A) are electrically coupled to a same color LED, the padsdirectly adjacent to the pads most proximate to the side 240 are coupledto a same color LED, and so on until an opposing side 242 is reached.

FIG. 3A illustrates a bottom view of the LED light strip 200. FIG. 3Aillustrates a bottom side opposing the top side in the view of FIG. 2 .The bottom side of the LED light strip 200 can include a protectivesupport or adhesive layer 212. The LED light strip 200 further includesadditional connecting tabs 330, 331. The connecting tab 330 includespads 334A, 334B, 334C, 334D. The connecting tab 331 includes pads 335A,335B, 335C, 335D. The pads 334A, 335A can be electrically coupled toLEDs of a first color, the pads 334B, 335B can be electrically coupledto LEDs of a second color, the pads 334C, 335C can be electricallycoupled to LEDs of a third color, and the pads 334D, 335D can beelectrically coupled to LEDs of a fourth color.

The pads 334A, 334B, 334C, 334D can be staggered from the pads 234A,234B, 234C, 234D, such that a footprint of the pads 234A, 234B, 234C,234D does not completely overlap the footprint of the pads 334A, 334B,334C, 334D. The pads 335A, 335B, 335C, 335D can be staggered from thepads 235A, 235B, 235C, 235D, such that a footprint of the pads 235A,235B, 235C, 235D does not completely overlap the footprint of the pads335A, 335B, 335C, 335D. Such a staggering can help reduce electricalinterference or cross-talk between electrical signals.

The pads 334A, 335A can be electrically coupled LEDs of a differentcolor than the pads 234A, 235A. In some embodiments, the pads 334A, 335Aare electrically coupled to the same LEDs as the pads 234D, 235D. Thepads 334B, 335B can be electrically coupled LEDs of a different colorthan the pads 234B, 235B. In some embodiments, the pads 334B, 335B areelectrically coupled to the same LEDs as the pads 234C, 235C. The pads334C, 335C can be electrically coupled LEDs of a different color thanthe pads 234C, 235C. In some embodiments, the pads 334C, 335C areelectrically coupled to the same LEDs as the pads 234B, 235B. The pads334D, 335D can be electrically coupled LEDs of a different color thanthe pads 234D, 235D. In some embodiments, the pads 334D, 335D areelectrically coupled to the same LEDs as the pads 234A, 235A.

For the LED light strip 200, and similar to the embodiment discussedwith respect to FIG. 1 , circuit traces can provide electricalconnection to LEDs 236, which can be LED dies, such as for power andcontrol. In the illustrated embodiment, the terminal connecting tabs230, 231, 330, 331 are not formed from a top or bottom layer of theflexible PCB 210 but are instead formed from one or more intermediatelayers that extend beyond the rest of the flexible PCB layers. Theextending intermediate layer forming the terminal connecting tab 230,231, 330, 331 can be used to provide a solder interconnection withanother flexible PCB. In some embodiments, the flexible PCB 210 can beconnected to itself to form a circular or other shaped light strip.

FIG. 2B illustrates the LED light strip 200 of FIG. 2A after theconnecting tabs 230, 231 are situated proximate each other, such as forsoldering the pads 234A, 234B, 234C, 234D to the pads 235A, 235B, 235C,235D, respectively. FIG. 3B illustrates the LED light strip 200 of FIG.3A after the connecting tabs 330, 331 are situated proximate each other,such as for soldering the pads 334A, 334B, 334C, 334D to the pads 335A,335B, 335C, 335D, respectively

FIGS. 4 and 5 illustrate alternative cross sections of LED light strips400 and 500. The LED light strip 400 includes a pressure sensitiveadhesive (PSA) 442. A solder mask 444 is situated on the PSA 442.Conductive material 446 is situated on the solder mask 444. The soldermask 444 can be a liquid photo-imageable (LPI) material, silicone, orthe like. The conductive material 446 can include copper, silver, gold,aluminum, stainless steel, an alloy thereof, or the like. A basematerial 448 can be situated between conductive layers 454 and 446. Anadhesive layer 452 can bond the conductive layer 454, 446 the basematerial 448, 450, and the solder mask 444. The base material 448, 450,can include a polyimide (PI), another polymer, FR-4, prepreg, acombination thereof, or the like. The conductive material 454, basematerial 450, and adhesive 452 can extend, in a first direction, beyondmaterial situated below the based material 450 to form a connecting tab456. The conductive material 446, adhesive 452, and base material 448can extend, in a second direction opposite the first direction, beyondmaterial situated above the base material 448 to form the connecting tab446. Electrical pads can be formed on the connecting tab 446 or 456,such as to provide electrical connectivity to the conductive material446, 456, respectively.

The LED light strip 500 includes a pressure sensitive adhesive (PSA) 442on a liner 550. The liner 550 can include paper, plastic, or acombination thereof. The liner 550 can be disposable. The liner 550 caninclude a Poly-Coated Craft (PCK) material. A solder mask 444 issituated on the PSA 442. Conductive material 446 is situated on thesolder mask 444. A base material 448 can be situated between conductivelayers 454 and 446. An adhesive layer 452 can bond a conductive layer552 and the base material 448. Another base material 450 can be situatedon the conductive material 552. The conductive material 454 can besituated on the base material 450. A solder mask 554, 556 can besituated on the conductive material 454. The conductive material 446,solder mask 444, and PSA 442 can extend beyond material situated abovethe conductive material 446 and below the PSA 442 to form the connectingtab 558.

As illustrated in both FIGS. 4 and 5 , the LED light strips 400 and 500are formed from multiple insulating and copper layers, with at least onelayer forming the terminal connecting tab 446, 456, or 558.

FIG. 6 illustrates in cross section an alternative of an LED light strip600. In this embodiment based on two level soldering process and design,bottom solder pads (electrodes) are shifted compared to top solder padsso as not to be superposed vertically, minimizing shorting risk. Solderpads correspond to exposed portion of conductive material 666, 676. TheLED light strip 600 is similar to the LED light strip 400 with a liner550 below the PSA 442 and a conductive material 660 between the base 448and the adhesive 452. The liner 550 can include a paper material,plastic material, or a combination thereof. Poly-Coated Kraft is anexample of a disposable liner material. The LED strip 600 includesconnecting tabs 662, 664 extending in different directions therefrom.

FIG. 7 illustrates in cross-section an alternative of an LED light strip700. The LED light strip 600 is similar to the LED light strip 600without the connecting tab 662 and including a via 770 connectingconductive material 446 and 454. To cover the solder pads on or formedin the conductive material 446, 454, the bottom PSA 550 can be appliedafter soldering on the conductive material 446 is completed. A tape tab,such as a Kapton® tab, can also be included at these locations prior toPSA 550 integration, such as to reinforce the dielectric strength.

FIG. 8 illustrates a cross-section view of two ends of one or more LEDlight strips 886, 888 being electrically connected at connecting tabs890, 892 thereof. The LED light strips 886, 888 include LED dies 880,882 thereon. The LED dies 880, 882 can include LEDs of multiple colorsthereon. The colors can include one or more of R, G, B, W, among others.Solder 884, or other electrical adhesive, can be situated on one or moreof the connecting tabs 890, 892. The connecting tabs 890, 892 can bepressed together such that the solder 884 mechanically bonds andelectrically connects electrical pads of the connecting tabs 890, 892.As seen with respect to FIG. 8 , light strip 886 includes a copper layer894 with an extending terminal connecting tab 890, 892 that can bejoined to another end of a same or another LED light strip. Multipleextending tab connection is also possible, as seen with respect to FIG.9 .

FIG. 9 illustrates a cross-section view of two ends of one or more LEDlight strips 990, 992 being electrically connected at connecting tabs994, 995 (the inner connecting tabs are not labeled so as to not obscurethe view) thereof. The LED light strips 990, 992 include the LED dies880, 882 thereon. Solder 996, 998 or other electrical adhesive, can besituated on one or more of the connecting tabs 994, 995. The connectingtabs 994, 995 can be pressed together such that the solder 996, 998mechanically bonds and electrically connects electrical pads of theconnecting tabs 994, 995. Multiple connecting tabs 994 of the LED lightstrip 992 can be electrically and mechanically coupled to matingmultiple connecting tabs 995 of the LED light strip 990, simultaneously.As seen with respect to FIG. 9 , the light strip 990 includes conductivematerial 997, 999 on corresponding extending terminal connecting tabs995 that can be joined, respectively, to conductive material 993, 991 onextending terminal connecting tabs 994 of the same or another LED lightstrip.

FIG. 10 illustrates a cross-section view of two ends of one or more LEDlight strips 1012, 1014 being electrically connected. Since the LEDlight strips 1012, 1014 are formed on the flexible PCB and include oneor more connecting tabs 1016, the light strips 1012, 1014 can be pressedtogether with adhesive 1010 forming a bond between the light strips1012, 1014. Support for conductive material can be provided by one ormore base, adhesive, or other layers of the flexible PCB.Advantageously, electrically or mechanically coupling LED light stripsby the connecting tabs can reduce mechanical or electrical breakage whenthe LED light strips are subjected to twist or pull apart force. This iscompared to prior solutions that use wire bonds, or a solder bridgeacross solder pads to electrically and mechanically coupled the LEDlight strips.

FIG. 11 illustrates a cross-section view of two ends 1102, 1104 of oneor more LED light strips in close proximity, before electricalconnection. The flexible printed circuit (FPC) end 1102 includes amaterial stack including a solder mask material 1118A, a conductivematerial 1104A on the solder mask material 1116A, a first adhesive 1114Abonding the conductive material 1116A and a dielectric material 1112A, asecond adhesive 1110A bonding the dielectric material 1112A and a secondconductive material 1108A, and a solder mask 1106A on the conductivematerial 1108A. The flexible printed circuit (FPC) end 1104 includes asame material stack including a solder mask material 1118B, a conductivematerial 1104B on the solder mask material 1116B, a first adhesive 1114Bbonding the conductive material 1116B and a dielectric material 1112B, asecond adhesive 1110B bonding the dielectric material 1112B and a secondconductive material 1108B, and a solder mask 1106B on the conductivematerial 1108B. Conductive material 1220, 1222 (see FIG. 12 ) can beapplied to electrically and mechanically connect the conductive material1108A and 1108B, and 1116A and 1116B, respectively. Unfortunately,electrically and mechanically coupling such structures comes with a riskof shorting the conductive material 1108A and 1108B and 1116A and 1116B.This is illustrated in FG. 12.

FIG. 12 illustrates a cross-section view of the two ends of the one ormore LED light strips of FIG. 11 after electrical connection. Since theconductive material 1220 is stacked directly over the conductivematerial 1222, and over the ends, there is a risk that conductivematerial 1220, 1222 will bridge together, shorting the conductivematerial 1108A, 1108B, 1116A, and 1116B. The solder joints (conductivematerial 1220, 1222) can be staggered to help reduce the chances of theconductive material 1220, 1222 bridging. Many examples of suchstaggering are presented already and some more are presented regardingFIGS. 13, 14, and 15 .

FIG. 13 illustrates a cross-section view of two ends 1302, 1304 of oneor more LED light strips that, before electrical connection, includesoffset conductive pads (exposed conductive material 1330A and 1330B, and1338A and 1338B). Instead of having exposed conductive material stackeddirectly over each other, as in FIGS. 11 and 12 , the ends 1302, 1304 ofone or more LED light strips include exposed conductive material offsetvertically. This helps reduce the changes that the conductive material1330A and 1330B does not bridge with conductive material 1338A and1338B.

The FPC end 1302 includes a material stack including a solder maskmaterial 1340A, a first conductive material 1338A on (in contact with)the solder mask material 1340A, a first adhesive 1336A bonding theconductive material 1338A and a dielectric material 1334A, and a secondadhesive 1332A bonding the dielectric material 1334A and a secondconductive material 1330A. The FPC end 1304 includes a material stackincluding a first conductive material 1338B, a first adhesive 1336Bbonding the first conductive material 1338B and a dielectric material1334B, a second adhesive 1332B bonding the dielectric material 1334B anda second conductive material 1330B, and a solder mask 1340B on (incontact with) the second conductive material 1330B.

FIG. 14 illustrates an example of a cross-section view of the two ends1302, 1304 of the one or more LED light strips of FIG. 13 afterelectrical connection. The electrical connection includes a conductivejoint 1440 that electrically and mechanically connects the secondconductive material 1330A and 1330B. Another conductive joint 1442 isillustrated electrically and mechanically connecting the firstconductive material 1338A and 1338B. Since the conductive joints 1440and 1442 are offset vertically from each other, it is much more unlikelyfor them to electrically short to each other. This is because conductivematerial would need to flow along line 1444 between the first conductivematerial 1330A, 1330B and second conductive material 1338A, 1338B toshort the conductive joints 1440 and 1442.

FIG. 15 illustrates another example of a cross-section view of the twoends 1302, 1304 of the one or more LED light strips of FIG. 13 afterelectrical connection. FIG. 15 is similar to FIG. 14 with more of theends 1302, 1304 illustrated including additional solder mask 1540A,1540B in view and with the FPCs deformed before electrical andmechanical connection by solder joints 1550, 1552. Because theconductive joints 1550, 1552 are offset from each other vertically (notstacked directly over one another or in the shadow of each other) theends 1302, 1304 can be bent and still be reliably electrically andmechanically connected without shorting the conductive joints 1550,1552. In contrast, the ends 1102, 1104 (see FIGS. 11 and 12 ) are muchmore likely to short the conductive joints 1220, 1222 if the ends arebent before or during electrical and mechanical connecting. This isbecause the already space between the conductive material 1108A or 1108Band 1116A or 1116B is further reduced when one or more ends 1102, 1104are bent or otherwise deformed.

FIG. 16 illustrates a power and control circuitry system 1600 forcontrolling an LED light strip, such as described herein. As seen inFIG. 16 , the system 1600 includes a power and control circuitry 1602that includes connectivity circuitry 1612 and processing circuitry 1614.The connectivity circuitry 1612 can include wireless or wired connectionfor user or automatic control via the processing circuitry 1614. In someembodiments, smart phones with lighting apps installed can be used toprovide lighting control and determine lighting status (e.g., LEDs on oroff). The processing circuitry 1614 can control a color tuning circuitry1616. The color tuning circuitry 1616 is able to change or adjust LEDcolor, temperature, intensity, or the like produced by the LED lightstrip 1601. Control and power is provided to LED die 1632 via LEDinterface circuitry 1620. The control circuitry 1602 can managecorrelated color temperature (CCT) tuning. A user can change the tint oflight along an iso-CCT line desired.

The power and LED control circuitry 1602 includes electrical orelectronic circuitry to enable the operation of the LEDs of the LEDlight strip 1601. Furthermore, the LED circuit boards of the LED lightstrip 1601 can include circuitry configured to manage individual orgrouped operation of the plurality LEDs in LED light strip 1601. In someembodiments, each LED can be separately controlled by the power andcontrol circuitry 1602, while in other embodiments groups of LEDs can becontrolled as a block. In still other embodiments, both single LEDs andgroups of LEDs can be controlled. In one embodiment, intensity can beseparately controlled and adjusted by setting appropriate ramp times andpulse width for each LED. This allows staging of LED activation toreduce power fluctuations, and to provide superior luminous intensitycontrol.

The LEDs discussed in this disclosure can include but are not limited toLEDs formed of sapphire or silicon carbide. The LEDs can be formed froman epitaxially grown or deposited semiconductor n-layer. A semiconductorp-layer can then be sequentially grown or deposited on the n-layer,forming an active region at the junction between layers. Semiconductormaterials capable of forming high-brightness light emitting devices caninclude, but are not limited to, Group III-V semiconductors,particularly binary, ternary, and quaternary alloys of gallium,aluminum, indium, and nitrogen, also referred to as III-nitridematerials. In certain embodiment, laser light emitting elements can beused.

Color of emitted light from the LEDs can be modified using a phosphorcontained in glass, or as a pre-formed sintered ceramic phosphor, whichcan include one or more wavelength converting materials able to createwhite light or monochromatic light of other colors. All or only aportion of the light emitted by the LEDs may be converted by thewavelength converting material of the phosphor. Unconverted light may bepart of the final spectrum of light, though it need not be. Examples ofcommon devices include a blue-emitting LED segment combined with ayellow-emitting phosphor, a blue-emitting LED segment combined withgreen- and red-emitting phosphors, a UV-emitting LED segment combinedwith blue- and yellow-emitting phosphors, and a UV-emitting LED segmentcombined with blue-, green-, and red-emitting phosphors.

Direction of light emitted from each LED can be modified by one or moreoptics. Optic can be a single optical element or a multiple opticelements. Optical elements can include converging or diverging lenses,aspherical lens, Fresnel lens, or graded index lens, for example. Otheroptical elements such as mirrors, beam diffusers, filters, masks,apertures, collimators, or light waveguides are also included. Opticscan be positioned at a distance from the LED elements in order toreceive and redirect light from multiple LEDs. Alternatively, optics canbe set adjacent to each LED element to guide, focus, or defocus emittedlight. In some embodiments, optics are connected to actuators formovement. In some embodiments, actuator movement can be programmed. Thisallows, for example, a lens to be moved to increase or decrease beamsize.

Many modifications and other embodiments will come to the mind of oneskilled in the art having the benefit of the teachings presented in theforegoing descriptions and the associated drawings. Therefore, it isunderstood that embodiments are not to be limited to the specificembodiments disclosed, and that modifications and embodiments areintended to be included within the scope of the appended claims. It isalso understood that other embodiments may be practiced in the absenceof an element/step not specifically disclosed herein.

The invention claimed is:
 1. A flexible light emitting diode (LED)support assembly comprising: an LED die; a flexible circuit including: afirst layer, the first layer including a conductive materialelectrically connected to the LED die; a second layer, the second layerincluding an electrically insulating material; a third layer positionedbetween the first and second layer, the third layer having a firstterminal extended connecting tab that extends outward beyond the firstlayer and the second layer; a fourth layer including a second terminalextended connecting tab; and a fifth layer positioned between the firstand second terminal extended connecting tabs, the fifth layer includingelectrically insulating material, and the second terminal extendedconnecting tab extending outward beyond the first, second, and fifthlayers.
 2. The LED assembly of claim 1, further comprising the LED dieelectrically connected to the first layer.
 3. The LED assembly of claim1, wherein the second layer includes an adhesive material.
 4. The LEDassembly of claim 1, wherein the first terminal extended connecting tabincludes exposed solder pads.
 5. The LED assembly of claim 4, wherein anumber of the exposed solder pads is equal to a number of colors of LEDsin the LED die.
 6. The LED assembly of claim 1, wherein the secondterminal extended connecting tab extends outward beyond the third layer.7. The LED assembly of claim 1, wherein the second terminal extendedconnecting tab extends outward beyond the first layer, the second layer,and fifth layer in a direction opposite the first terminal extendedconnecting tab.
 8. The LED of claim 7, wherein the pads on the firstterminal extended connecting tab face a first direction and the pads onthe second terminal extended connecting tab face a second directionopposite the first direction.
 9. The LED assembly of claim 8, whereinthe pads on the first terminal extended connecting tab are offset fromthe pads on the second terminal extended connecting tab.
 10. The LEDassembly of claim 1, further comprising a second flexible circuitelectrically and mechanically coupled to the first terminal extendedconnecting tab using a conductive adhesive.
 11. The LED assembly ofclaim 1, wherein pads on an end of the flexible circuit opposite thefirst terminal extended electrically connecting tab are electricallyconnected to the first terminal extended connecting tab.
 12. The LEDassembly of claim 1, further comprising power and control circuitrycoupled to the flexible circuit, the power and control circuitryconfigured to provide power to the LED assembly and control color andbrightness of light emitted by the LED die.
 13. A flexible lightingapparatus comprising: a first layer, the first layer including aconductive material configured to connect to an LED die; a second layer,the second layer including an electrically insulating material; a thirdlayer positioned between the first and second layer, the third layerhaving a first terminal extended electrically connecting tab thatextends outward beyond the first layer and the second layer; a fourthlayer including a second terminal extended connecting tab; and a fifthlayer positioned between the first and second terminal extendedconnecting tabs, the fifth layer including electrically insulatingmaterial, and the second terminal extended connecting tab extendingoutward beyond the first, second, and fourth layers.
 14. The flexiblelighting apparatus of claim 13, further comprising the LED dieelectrically connected to the first layer.
 15. The flexible lightingapparatus of claim 13, wherein the second layer includes an adhesivematerial.
 16. The flexible lighting apparatus of claim 13, wherein thefirst terminal extended electrically connecting tab including exposedsolder pads.
 17. The flexible lighting apparatus of claim 16, wherein anumber of the exposed solder pads equal to a number of colors of LEDs inthe LED die.
 18. The flexible lighting apparatus of claim 13, whereinthe second terminal extended connecting tab extends outward beyond thethird layer.
 19. The flexible lighting apparatus of claim 18, whereinthe second terminal extended connecting tab extends outward beyond thefirst layer, the second layer, and fourth layer in a direction oppositethe first terminal extended connected tab.
 20. The flexible lightingapparatus of claim 19, wherein pads on the second terminal extendedconnecting tab face a direction opposite pads on the first terminalextended connecting tab.